Inventor

LIN HUNG-TA

TW39 patents

⚠️ This page may combine multiple inventors who share the name “LIN HUNG-TA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN HUNG-TA

TAIWAN SEMICONDUCTOR MFG

Method of making a FinFET device

FinFETs and methods for forming the same

Fin field effect transistor

Fin field effect transistor

Fin held effect transistor

Methods of forming epitaxial structures

Semiconductor device and formation thereof

Epitaxial structures

Double stepped semiconductor substrate

Method of tuning doping concentration in III-V compound semiconductor through co-doping donor and acceptor impurities

Delta doping layer in MOSFET source/drain region

Double stepped semiconductor substrate

TAIWAN SEMICONDUCTOR MFG CO LTD

Tunnel field-effect transistor

Fin field effect transistor

Vertical-gate-all-around devices and method of fabrication thereof

Tunnel field-effect transistor

III-V multi-channel FinFETs

Semiconductor device and formation thereof

Integrated circuit device having III-V compound semiconductor region comprising magnesium and N-type impurity and overlying III-V compound semiconductor layer formed without Cp2Mg precursor

Contacts for transistors

YU CHEN-HUA

Light-emitting diodes on concave texture substrate

Light-emitting diodes on concave texture substrate

Light-emitting diode with textured substrate

Light-emitting diode with textured substrate

Stress-alleviation layer for LED structures

III-V compound semiconductor epitaxy using lateral overgrowth

Carbon-containing semiconductor substrate

LIN HUNG-TA

FinFET and method of fabricating the same

III-V multi-channel FinFETs

CHEN DING-YUAN

Method of separating light-emitting diode from a growth substrate

Method of separating light-emitting diode from a growth substrate

CHEN CHI-MING

III-nitride growth method on silicon substrate

Substrate breakdown voltage improvement for group III-nitride on a silicon substrate

NIEH CHUN-FENG

Forming a protective film on a back side of a silicon wafer in a III-V family fabrication process

Junction leakage reduction through implantation

AVON PROD INC

Aqueous cosmetic coloring and gloss compositions having film formers

EPISTAR CORP

Light-emitting diodes on concave texture substrate

TSMC SOLID STATE LIGHTING LTD

Light-emitting diode with textured substrate

MITAC COMPUTING TECH CORP

Method for backing up configuration file