Inventor
MEYER MICHAEL J
US31 patents
⚠️ This page may combine multiple inventors who share the name “MEYER MICHAEL J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KENNAMETAL INC
5 patentsUS10562101B2Feb 18, 2020
Methods of making metal matrix composite and alloy articles
KENNAMETAL INC1 citations70
US11247268B2Feb 15, 2022
Methods of making metal matrix composite and alloy articles
KENNAMETAL INC0 citations60
US9862029B2Jan 9, 2018
Methods of making metal matrix composite and alloy articles
KENNAMETAL INC1 citations60
US12331382B2Jun 17, 2025
Sintered alloy articles and methods of making the same
KENNAMETAL INC0 citations58
US11376817B2Jul 5, 2022
Wear resistant articles and applications thereof
KENNAMETAL INC0 citations49
MEYER MICHAEL J
4 patentsUS8464920B2Jun 18, 2013
Sack pack sternum clip
MEYER MICHAEL J20 citations92
US8475045B2Jul 2, 2013
Bag with cover
MEYER MICHAEL J9 citations77
US8714425B2May 6, 2014
Cinch sack backpack with padded straps
MEYER MICHAEL J13 citations76
US11548833B2Jan 10, 2023
Method to formulate humic substances
MEYER MICHAEL J1 citations52
SONICS INC
4 patentsUS7325221B1Jan 29, 2008
Logic system with configurable interface
SONICS INC46 citations88
US6683474B2Jan 27, 2004
Method and apparatus for communication using a distributed multiplexed bus
SONICS INC29 citations87
US7739436B2Jun 15, 2010
Method and apparatus for round robin resource arbitration with a fast request to grant response
SONICS INC18 citations84
US7243264B2Jul 10, 2007
Method and apparatus for error handling in networks
SONICS INC10 citations83
ASM INC
3 patentsUNDER ARMOUR INC
2 patentsTHE CLEVER BABY LLC
2 patentsOSPREY PACKS INC
2 patentsCENTER FOR DEEP LEARNING IN ELECTRONICS MFG INC
2 patentsUS11823423B2Nov 21, 2023
Methods and systems for compressing shape data for electronic designs
CENTER FOR DEEP LEARNING IN ELECTRONICS MFG INC1 citations61
US11182929B2Nov 23, 2021
Methods and systems for compressing shape data for electronic designs
CENTER FOR DEEP LEARNING IN ELECTRONICS MFG INC1 citations61