Inventor

KANG HU

US53 patents

⚠️ This page may combine multiple inventors who share the name “KANG HU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KANG HU

LAM RES CORP

Inhibitor plasma mediated atomic layer deposition for seamless feature fill

Chamber undercoat preparation method for low temperature ALD films

Methods for depositing silicon oxide

Inhibitor plasma mediated atomic layer deposition for seamless feature fill

Gapfill of variable aspect ratio features with a composite PEALD and PECVD method

Sub-saturated atomic layer deposition and conformal film deposition

Gapfill of variable aspect ratio features with a composite PEALD and PECVD method

Gapfill of variable aspect ratio features with a composite PEALD and PECVD method

Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity

Gapfill of variable aspect ratio features with a composite PEALD and PECVD method

Low volume showerhead with porous baffle

Single ALD cycle thickness control in multi-station substrate deposition systems

Ultrathin atomic layer deposition film accuracy thickness control

Multi-cycle ALD process for film uniformity and thickness profile modulation

Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD system

Dynamic precursor dosing for atomic layer deposition

Variable temperature hardware and methods for reduction of wafer backside deposition

Single ALD cycle thickness control in multi-station substrate deposition systems

Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD system

Systems and methods for removing particles from a substrate processing chamber using RF plasma cycling and purging

Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity

Low volume showerhead with faceplate holes for improved flow uniformity

Ultrathin atomic layer deposition film accuracy thickness control

Gapfill of variable aspect ratio features with a composite PEALD and PECVD method

Ultrathin atomic layer deposition film accuracy thickness control

Dynamic precursor dosing for atomic layer deposition

Ultrathin atomic layer deposition film accuracy thickness control

Method for RF compensation in plasma assisted atomic layer deposition

Multi-cycle ALD process for film uniformity and thickness profile modulation

Dynamic precursor dosing for atomic layer deposition

Dynamic precursor dosing for atomic layer deposition

Method of atomic layer deposition

Substrate processing system with tandem source activation for CVD

Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity

Tandem source activation for CVD of films

Hardware and process for film uniformity improvement

Hardware and process for film uniformity improvement

Systems and methods for removing particles from a substrate processing chamber using RF plasma cycling and purging

Tandem source activation for CVD of films

Tandem source activation for cyclical deposition of films

NOVELLUS SYSTEMS INC

Methods for depositing films on sensitive substrates

Methods for depositing films on sensitive substrates

Methods for depositing films on sensitive substrates

Plasma activated conformal film deposition

Methods for depositing films on sensitive substrates

Methods for modulating step coverage during conformal film deposition

LI MING

Plasma-activated deposition of conformal films

Plasma-activated deposition of conformal films

LAVOIE ADRIEN

Plasma activated conformal film deposition

UNIV NORTHWESTERN

Twisted π-electron system chromophore compounds with very large molecular hyperpolarizabilities and related compositions and devices