Inventor
HSU JU-WANG
TW27 patents
⚠️ This page may combine multiple inventors who share the name “HSU JU-WANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
23 patentsUS7425740B2Sep 16, 2008
Method and structure for a 1T-RAM bit cell and macro
TAIWAN SEMICONDUCTOR MFG278 citations98
US7259050B2Aug 21, 2007
Semiconductor device and method of making the same
TAIWAN SEMICONDUCTOR MFG75 citations98
US7052946B2May 30, 2006
Method for selectively stressing MOSFETs to improve charge carrier mobility
TAIWAN SEMICONDUCTOR MFG84 citations98
US7223647B2May 29, 2007
Method for forming integrated advanced semiconductor device using sacrificial stress layer
TAIWAN SEMICONDUCTOR MFG28 citations92
US6884736B2Apr 26, 2005
Method of forming contact plug on silicide structure
TAIWAN SEMICONDUCTOR MFG20 citations91
US6498067B1Dec 24, 2002
Integrated approach for controlling top dielectric loss during spacer etching
TAIWAN SEMICONDUCTOR MFG51 citations91
US7265060B2Sep 4, 2007
Bi-level resist structure and fabrication method for contact holes on semiconductor substrates
TAIWAN SEMICONDUCTOR MFG12 citations84
US7256498B2Aug 14, 2007
Resistance-reduced semiconductor device and methods for fabricating the same
TAIWAN SEMICONDUCTOR MFG14 citations84
US7008878B2Mar 7, 2006
Plasma treatment and etching process for ultra-thin dielectric films
TAIWAN SEMICONDUCTOR MFG18 citations84
US6787455B2Sep 7, 2004
Bi-layer photoresist method for forming high resolution semiconductor features
TAIWAN SEMICONDUCTOR MFG16 citations84
US6780782B1Aug 24, 2004
Bi-level resist structure and fabrication method for contact holes on semiconductor substrates
TAIWAN SEMICONDUCTOR MFG7 citations74
US6706640B1Mar 16, 2004
Metal silicide etch resistant plasma etch method
TAIWAN SEMICONDUCTOR MFG11 citations74
US6838381B2Jan 4, 2005
Methods for improving sheet resistance of silicide layer after removal of etch stop layer
TAIWAN SEMICONDUCTOR MFG11 citations71
US7378308B2May 27, 2008
CMOS devices with improved gap-filling
TAIWAN SEMICONDUCTOR MFG4 citations63
US7271448B2Sep 18, 2007
Multiple gate field effect transistor structure
TAIWAN SEMICONDUCTOR MFG5 citations62
US8030214B2Oct 4, 2011
Method of fabricating gate structures
TAIWAN SEMICONDUCTOR MFG2 citations57
US7875547B2Jan 25, 2011
Contact hole structures and contact structures and fabrication methods thereof
TAIWAN SEMICONDUCTOR MFG0 citations52
US7341935B2Mar 11, 2008
Alternative interconnect structure for semiconductor devices
TAIWAN SEMICONDUCTOR MFG0 citations52
US7316970B2Jan 8, 2008
Method for forming high selectivity protection layer on semiconductor device
TAIWAN SEMICONDUCTOR MFG0 citations52
US7256137B2Aug 14, 2007
Method of forming contact plug on silicide structure
TAIWAN SEMICONDUCTOR MFG1 citations52
US7678655B2Mar 16, 2010
Spacer layer etch method providing enhanced microelectronic device performance
TAIWAN SEMICONDUCTOR MFG1 citations51
US7179701B2Feb 20, 2007
Transistor with high dielectric constant gate and method for forming the same
TAIWAN SEMICONDUCTOR MFG0 citations48
US7400401B2Jul 15, 2008
Measuring low dielectric constant film properties during processing
TAIWAN SEMICONDUCTOR MFG0 citations41