P

Inventor

LIU XIAO H

US26 patents
⚠️ This page may combine multiple inventors who share the name “LIU XIAO H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

18 patents
US7902541B2Mar 8, 2011

Semiconductor nanowire with built-in stress

IBM22 citations92
US7173312B2Feb 6, 2007

Structure and method to generate local mechanical gate stress for MOSFET channel mobility modification

IBM20 citations92
US7067902B2Jun 27, 2006

Building metal pillars in a chip for structure support

IBM42 citations92
US7989233B2Aug 2, 2011

Semiconductor nanowire with built-in stress

IBM13 citations84
US7335980B2Feb 26, 2008

Hardmask for reliability of silicon based dielectrics

IBM12 citations84
US7314789B2Jan 1, 2008

Structure and method to generate local mechanical gate stress for MOSFET channel mobility modification

IBM13 citations84
US7622737B2Nov 24, 2009

Test structures for electrically detecting back end of the line failures and methods of making and using the same

IBM7 citations74
US7456098B2Nov 25, 2008

Building metal pillars in a chip for structure support

IBM8 citations74
US9761482B2Sep 12, 2017

Enhancement of iso-via reliability

IBM1 citations63
US8969174B2Mar 3, 2015

Fixed curvature force loading of mechanically spalled films

IBM2 citations63
US8846191B2Sep 30, 2014

Thermal expansion control employing platelet fillers

IBM2 citations63
US8362596B2Jan 29, 2013

Engineered interconnect dielectric caps having compressive stress and interconnect structures containing same

IBM4 citations63
US7847402B2Dec 7, 2010

BEOL interconnect structures with improved resistance to stress

IBM4 citations63
US7485582B2Feb 3, 2009

Hardmask for improved reliability of silicon based dielectrics

IBM5 citations63
US10460985B2Oct 29, 2019

Enhancement of iso-via reliability

IBM0 citations52
US8803284B2Aug 12, 2014

Thick on-chip high-performance wiring structures

IBM0 citations52
US7787101B2Aug 31, 2010

Apparatus and method for reducing contamination in immersion lithography

IBM0 citations52
US7678673B2Mar 16, 2010

Strengthening of a structure by infiltration

IBM0 citations52

HOUGHAM GARETH

2 patents

GLOBALFOUNDRIES INC

2 patents

ELPIS TECH INC

1 patent

COONEY III EDWARD C

1 patent

HOUGHAM GARETH G

1 patent

CHIDAMBARRAO DURESETI

1 patent