Inventor

SRIRAM MANDYAM

US55 patents

⚠️ This page may combine multiple inventors who share the name “SRIRAM MANDYAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SRIRAM MANDYAM

APPLIED MATERIALS INC

Processing system containing an isolation region separating a deposition chamber from a treatment chamber

Bottom-up gap-fill by surface poisoning treatment

MOSFET gate engineerinng with dipole films

PMOS high-k metal gates

Paired dynamic parallel plate capacitively coupled plasmas

Single wafer processing environments with spatial separation

Enhanced spatial ALD of metals through controlled precursor mixing

PMOS high-K metal gates

Injector for batch processing and methods of use

Paired dynamic parallel plate capacitively coupled plasmas

Injector for batch processing and methods of use

Enhanced spatial ALD of metals through controlled precursor mixing

Method of tuning film properties of metal nitride using plasma

Method of tuning film properties of metal nitride using plasma

Top lamp module for carousel deposition chamber

In-situ tungsten deposition without barrier layer

Wafer out of pocket detection

Batch processing chambers for plasma-enhanced deposition

In-situ film annealing with spatial atomic layer deposition

Apparatus and methods for fine planar non-uniformity improvement

NOVELLUS SYSTEMS INC

Protective self-aligned buffer layers for damascene interconnects

Protective self-aligned buffer layers for damascene interconnects

Interfacial layers for electromigration resistance improvement in damascene interconnects

Plasma activated conformal dielectric film deposition

Interfacial layers for electromigration resistance improvement in damascene interconnects

Plasma activated conformal dielectric film deposition

Plasma activated conformal dielectric film deposition

Plasma activated conformal film deposition

Carbon deposition-etch-ash gap fill process

Protective self-aligned buffer layers for damascene interconnects

High compressive stress carbon liners for MOS devices

Protective self-aligned buffer layers for damascene interconnects

High compressive stress carbon liners for MOS devices

Method for making high stress boron-doped carbon films

In-situ deposition of film stacks

Interfacial layers for electromigration resistance improvement in damascene interconnects

ANTONELLI GEORGE ANDREW

Depositing conformal boron nitride film by CVD without plasma

Remote plasma processing of interface surfaces

Remote plasma processing of interface surfaces

Apparatus including a plasma chamber and controller including instructions for forming a boron nitride layer

LI MING

Plasma-activated deposition of conformal films

Plasma-activated deposition of conformal films

SWAMINATHAN SHANKAR

Conformal doping via plasma activated atomic layer deposition and conformal film deposition

Plasma activated conformal dielectric film deposition

LAVOIE ADRIEN

Plasma activated conformal film deposition

Plasma activated conformal dielectric film deposition

FOX KEITH

Smooth silicon-containing films

HAVERKAMP JASON

In-situ deposition of film stacks

CHATTOPADHYAY KAUSHIK

Protective self-aligned buffer layers for damascene interconnects

HOLLISTER ALICE

PECVD deposition of smooth silicon films