Inventor

HUANG FU-MING

TW23 patents

⚠️ This page may combine multiple inventors who share the name “HUANG FU-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG FU-MING

TAIWAN SEMICONDUCTOR MFG CO LTD

Mechanisms for removing debris from polishing pad

Interconnect structure for semiconductor devices

Post-CMP cleaning and apparatus

Chemical mechanical polishing apparatus and method

Chemical mechanical polishing apparatus including a multi-zone platen

Chemical mechanical planarization tool

Post-CMP cleaning and apparatus

Post-CMP cleaning and apparatus

Ion implant process for defect elimination in metal layer planarization

Post-CMP cleaning and apparatus

Slurry composition and method for polishing and integrated circuit

Chemical mechanical planarization tool

Methods for chemical mechanical polishing and forming interconnect structure

Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure

Methods for chemical mechanical polishing and forming interconnect structure

Interconnect structure for semiconductor devices

Interconnect structure for semiconductor devices

Brush cleaning method

Interconnects for semiconductor devices

Method of fabricating a semiconductor device, and chemical mechanical polish tool

(unassigned)

Method of manufacturing a biodegradable container

TSAI CHI-MING

Reduction of OCD measurement noise by way of metal via slots

HUANG FU-MING

Brush cleaning system