Inventor
KAGA YUKINAO
JP25 patents
⚠️ This page may combine multiple inventors who share the name “KAGA YUKINAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KOKUSAI ELECTRIC CORP
10 patentsUS10640869B2May 5, 2020
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP3 citations73
US11031270B2Jun 8, 2021
Substrate processing apparatus, substrate holder and mounting tool
KOKUSAI ELECTRIC CORP1 citations62
US10388530B2Aug 20, 2019
Method of manufacturing semiconductor device and substrate processing apparatus
KOKUSAI ELECTRIC CORP1 citations62
US12503767B2Dec 23, 2025
Non-transitory computer-readable recording medium, substrate processing apparatus and substrate processing method
KOKUSAI ELECTRIC CORP0 citations60
US12000045B2Jun 4, 2024
Method of manufacturing semiconductor device, non-transitory computer-readable recording medium, substrate processing apparatus and substrate processing method
KOKUSAI ELECTRIC CORP0 citations60
US12518997B2Jan 6, 2026
Substrate processing apparatus, method of manufacturing semiconductor device, and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations57
US11854850B2Dec 26, 2023
Substrate processing apparatus, method of manufacturing semiconductor device, method of loading substrate and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations57
US11004676B2May 11, 2021
Method for manufacturing semiconductor device, non-transitory computer-readable recording medium, and substrate processing apparatus
KOKUSAI ELECTRIC CORP0 citations51
US11876010B2Jan 16, 2024
Substrate processing apparatus and recording medium
KOKUSAI ELECTRIC CORP0 citations48
US10559485B2Feb 11, 2020
Method of manufacturing semiconductor device, method of loading substrate and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations46
HITACHI INT ELECTRIC INC
9 patentsUS9508555B2Nov 29, 2016
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC8 citations82
US9472398B2Oct 18, 2016
Method of manufacturing semiconductor device and substrate processing apparatus
HITACHI INT ELECTRIC INC3 citations72
US9340873B2May 17, 2016
Semiconductor device manufacturing method and substrate processing apparatus
HITACHI INT ELECTRIC INC4 citations72
US9263269B2Feb 16, 2016
Reaction tube, substrate processing apparatus and method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC1 citations52
US9650715B2May 16, 2017
Method of forming metal-containing film
HITACHI INT ELECTRIC INC0 citations51
US9416446B2Aug 16, 2016
Semiconductor device manufacturing method and substrate processing apparatus
HITACHI INT ELECTRIC INC0 citations51
US9972500B2May 15, 2018
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC0 citations50
US10622213B2Apr 14, 2020
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC0 citations41
US10366894B2Jul 30, 2019
Method of manufacturing semiconductor device, substrate processing device, and recording medium
HITACHI INT ELECTRIC INC0 citations41