Inventor
KO SEN-HOU
US43 patents
⚠️ This page may combine multiple inventors who share the name “KO SEN-HOU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
38 patentsUS6520847B2Feb 18, 2003
Polishing pad having a grooved pattern for use in chemical mechanical polishing
APPLIED MATERIALS INC90 citations99
US6183354B1Feb 6, 2001
Carrier head with a flexible membrane for a chemical mechanical polishing system
APPLIED MATERIALS INC276 citations99
US5964653AOct 12, 1999
Carrier head with a flexible membrane for a chemical mechanical polishing system
APPLIED MATERIALS INC194 citations99
US5795215AAug 18, 1998
Method and apparatus for using a retaining ring to control the edge effect
APPLIED MATERIALS INC243 citations98
US5921855AJul 13, 1999
Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
APPLIED MATERIALS INC207 citations97
US6991528B2Jan 31, 2006
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC45 citations96
US6896584B2May 24, 2005
Method of controlling carrier head with multiple chambers
APPLIED MATERIALS INC29 citations96
US6824455B2Nov 30, 2004
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
APPLIED MATERIALS INC67 citations96
US6699115B2Mar 2, 2004
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
APPLIED MATERIALS INC63 citations96
US6146259ANov 14, 2000
Carrier head with local pressure control for a chemical mechanical polishing apparatus
APPLIED MATERIALS INC81 citations96
US7182680B2Feb 27, 2007
Apparatus for conditioning processing pads
APPLIED MATERIALS INC15 citations93
US7175505B1Feb 13, 2007
Method for adjusting substrate processing times in a substrate polishing system
APPLIED MATERIALS INC21 citations93
US7040971B2May 9, 2006
Carrier head with a flexible membrane
APPLIED MATERIALS INC13 citations93
US6857946B2Feb 22, 2005
Carrier head with a flexure
APPLIED MATERIALS INC12 citations93
US6656842B2Dec 2, 2003
Barrier layer buffing after Cu CMP
APPLIED MATERIALS INC41 citations93
US6648740B2Nov 18, 2003
Carrier head with a flexible membrane to form multiple chambers
APPLIED MATERIALS INC22 citations93
US6540594B2Apr 1, 2003
Carrier head with a flexible membrane for a chemical mechanical polishing system
APPLIED MATERIALS INC16 citations93
US6511367B2Jan 28, 2003
Carrier head with local pressure control for a chemical mechanical polishing apparatus
APPLIED MATERIALS INC17 citations93
US6506104B2Jan 14, 2003
Carrier head with a flexible membrane
APPLIED MATERIALS INC16 citations93
US6386955B2May 14, 2002
Carrier head with a flexible membrane for a chemical mechanical polishing system
APPLIED MATERIALS INC23 citations93
US6277010B1Aug 21, 2001
Carrier head with a flexible membrane for a chemical mechanical polishing system
APPLIED MATERIALS INC18 citations93
US6106378AAug 22, 2000
Carrier head with a flexible membrane for a chemical mechanical polishing system
APPLIED MATERIALS INC44 citations93
US5938507AAug 17, 1999
Linear conditioner apparatus for a chemical mechanical polishing system
APPLIED MATERIALS INC56 citations93
US6913518B2Jul 5, 2005
Profile control platen
APPLIED MATERIALS INC25 citations92
US6669538B2Dec 30, 2003
Pad cleaning for a CMP system
APPLIED MATERIALS INC32 citations92
US6432826B1Aug 13, 2002
Planarized Cu cleaning for reduced defects
APPLIED MATERIALS INC35 citations92
US7993485B2Aug 9, 2011
Methods and apparatus for processing a substrate
APPLIED MATERIALS INC24 citations91
US7207878B2Apr 24, 2007
Conductive polishing article for electrochemical mechanical polishing
APPLIED MATERIALS INC11 citations84
US6368191B1Apr 9, 2002
Carrier head with local pressure control for a chemical mechanical polishing apparatus
APPLIED MATERIALS INC10 citations74
US9711381B2Jul 18, 2017
Methods and apparatus for post-chemical mechanical planarization substrate cleaning
APPLIED MATERIALS INC2 citations73
US8813293B2Aug 26, 2014
Apparatus and methods for brush and pad conditioning
APPLIED MATERIALS INC2 citations63
US7666061B2Feb 23, 2010
Method for conditioning processing pads
APPLIED MATERIALS INC4 citations63
US7104267B2Sep 12, 2006
Planarized copper cleaning for reduced defects
APPLIED MATERIALS INC3 citations63
US7749048B2Jul 6, 2010
Polishing pad conditioning process
APPLIED MATERIALS INC2 citations62
US7199056B2Apr 3, 2007
Low cost and low dishing slurry for polysilicon CMP
APPLIED MATERIALS INC2 citations59
US7828626B2Nov 9, 2010
Apparatus for conditioning processing pads
APPLIED MATERIALS INC0 citations52
US7115024B2Oct 3, 2006
Profile control platen
APPLIED MATERIALS INC0 citations52
US9508575B2Nov 29, 2016
Disk/pad clean with wafer and wafer edge/bevel clean module for chemical mechanical polishing
APPLIED MATERIALS INC0 citations42