Inventor
MORITA KOSUKE
JP18 patents
⚠️ This page may combine multiple inventors who share the name “MORITA KOSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NITTO DENKO CORP
11 patentsUS9754894B2Sep 5, 2017
Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealing
NITTO DENKO CORP2 citations71
US9659883B2May 23, 2017
Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package
NITTO DENKO CORP2 citations70
US8580619B2Nov 12, 2013
Method for producing semiconductor device
NITTO DENKO CORP3 citations62
US12473458B2Nov 18, 2025
Sealing method
NITTO DENKO CORP0 citations61
US12234387B2Feb 25, 2025
Sealant sheet
NITTO DENKO CORP0 citations61
US9085685B2Jul 21, 2015
Under-fill material and method for producing semiconductor device
NITTO DENKO CORP2 citations60
US8906746B2Dec 9, 2014
Method for producing semiconductor device
NITTO DENKO CORP0 citations52
US9472439B2Oct 18, 2016
Reinforcing sheet and method for producing secondary mounted semiconductor device
NITTO DENKO CORP1 citations50
US9368421B2Jun 14, 2016
Under-fill material and method for producing semiconductor device
NITTO DENKO CORP0 citations50
US10128131B2Nov 13, 2018
Sealing sheet with separators on both surfaces, and method for manufacturing semiconductor device
NITTO DENKO CORP0 citations48
US11891506B2Feb 6, 2024
Sealant sheet
NITTO DENKO CORP0 citations47