Inventor

ISHIZAKA TSUYOSHI

JP4 patents

Patents

4 patents

US9659883B2May 23, 2017

Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package

NITTO DENKO CORP2 citations70

US10301509B2May 28, 2019

Sheet for thermal bonding and sheet for thermal bonding with affixed dicing tape

NITTO DENKO CORP1 citations58

US7268191B2Sep 11, 2007

Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby

NITTO DENKO CORP0 citations50

US10128131B2Nov 13, 2018

Sealing sheet with separators on both surfaces, and method for manufacturing semiconductor device

NITTO DENKO CORP0 citations48