Inventor

IINO CHIE

JP4 patents

Patents

4 patents

US9754894B2Sep 5, 2017

Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealing

NITTO DENKO CORP2 citations71

US9659883B2May 23, 2017

Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package

NITTO DENKO CORP2 citations70

US10128131B2Nov 13, 2018

Sealing sheet with separators on both surfaces, and method for manufacturing semiconductor device

NITTO DENKO CORP0 citations48

US10074582B2Sep 11, 2018

Sealing sheet

NITTO DENKO CORP0 citations39