Inventor

HUANG CHIEN-PING

TW247 patents

⚠️ This page may combine multiple inventors who share the name “HUANG CHIEN-PING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG CHIEN-PING

SILICONWARE PRECISION INDUSTRIES CO LTD

Module device of stacked semiconductor packages and method for fabricating the same

Ball grid array semiconductor package and substrate without power ring or ground ring

Crack-preventive semiconductor package

Semiconductor package having heat sink at the outer surface

Image sensor of a quad flat package

Method of making semiconductor package with heat spreader

Quad flat non-lead package of semiconductor

Leadless image sensor package structure and method for making the same

Externally-embedded heat-dissipating device for ball grid array integrated circuit package

Thermally enhanced quad flat non-lead package of semiconductor

Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereof

Wafer level semiconductor package with build-up layer and method for fabricating the same

Chip carrier for semiconductor chip

Semiconductor package with flash-proof device

Image sensor of a quad flat package

Semiconductor package and fabricating method thereof

Structure of a multi chip module having stacked chips

Low-profile semiconductor package with strengthening structure

Stacked-die package structure

Semiconductor package

Multiple stacked-chip packaging structure

Heat dissipation ball grid array package

Semiconductor package with embedded heat-dissipating device

Method of achieving solder ball coplanarity on ball grid array integrated circuit package

Ball grid array integrated circuit package structure

Universal lead frame type of quad flat non-lead package of semiconductor

Tiny ball grid array package

Bump structure of semiconductor package and method for fabricating the same

Dual-chip integrated circuit package with a chip-die pad formed from leadframe leads

Semiconductor package having a heat sink with an exposed surface

Heat-dissipating structure for integrated circuit package

Package structure fabrication method

Stacked semiconductor structure and fabrication method thereof

Method for fabricating thermally enhanced semiconductor package

Thermally enhanced semiconductor package

Flash-preventing window ball grid array semiconductor package, method for fabricating the same, and chip carrier used in the semiconductor package

Semiconductor package which has no resinous flash formed on lead frame and method for manufacturing the same

Semicondctor package

Semiconductor package having an exposed heat spreader

Semiconductor package having heat sink attached to substrate

Fabricating method for semiconductor package

Semiconductor package configuration based on lead frame having recessed and shouldered portions for flash prevention

Heat-dissipating structure for integrated circuit package

Method of singulating a batch of integrated circuit package units constructed on a single matrix base

Multimedia chip package

Chip carrier for accommodating passive component

Semiconductor package

Semiconductor package with a heat sink

SILICON PREC IND CO LTD

Package structure stacking chips on front surface and back surface of substrate

Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant