Inventor
REISS MARTIN
DE28 patents
⚠️ This page may combine multiple inventors who share the name “REISS MARTIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
21 patentsUS7271484B2Sep 18, 2007
Substrate for producing a soldering connection
INFINEON TECHNOLOGIES AG110 citations93
US6525416B2Feb 25, 2003
Electronic devices and a sheet strip for packaging bonding wire connections of electronic devices and method for producing them
INFINEON TECHNOLOGIES AG32 citations92
US6873060B2Mar 29, 2005
Electronic component with a semiconductor chip, method of producing an electronic component and a panel with a plurality of electronic components
INFINEON TECHNOLOGIES AG24 citations90
US7223639B2May 29, 2007
Method of producing an electronic component and a panel with a plurality of electronic components
INFINEON TECHNOLOGIES AG14 citations82
US6906928B2Jun 14, 2005
Electronic component with a semiconductor chip, and method of producing the electronic component
INFINEON TECHNOLOGIES AG10 citations73
US6664648B2Dec 16, 2003
Apparatus for applying a semiconductor chip to a carrier element with a compensating layer
INFINEON TECHNOLOGIES AG10 citations73
US6486538B1Nov 26, 2002
Chip carrier having ventilation channels
INFINEON TECHNOLOGIES AG7 citations73
US7030473B2Apr 18, 2006
Substrate-based IC package
INFINEON TECHNOLOGIES AG8 citations72
US6998296B2Feb 14, 2006
Electronic component and method for its production
INFINEON TECHNOLOGIES AG3 citations62
US6949820B2Sep 27, 2005
Substrate-based chip package
INFINEON TECHNOLOGIES AG2 citations61
US7368322B2May 6, 2008
Method for mounting a chip on a base and arrangement produced by this method
INFINEON TECHNOLOGIES AG6 citations60
US7256070B2Aug 14, 2007
Substrate-based housing component with a semiconductor chip
INFINEON TECHNOLOGIES AG6 citations60
US7245013B2Jul 17, 2007
Substrate based IC-package
INFINEON TECHNOLOGIES AG3 citations60
US7229857B2Jun 12, 2007
Method for producing a protection for chip edges and system for the protection of chip edges
INFINEON TECHNOLOGIES AG2 citations59
US6933595B2Aug 23, 2005
Electronic device and leadframe and methods for producing the electronic device and the leadframe
INFINEON TECHNOLOGIES AG2 citations59
US7384822B2Jun 10, 2008
Package for semiconductor components and method for producing the same
INFINEON TECHNOLOGIES AG2 citations58
US7008493B2Mar 7, 2006
Method for applying a semiconductor chip to a carrier element
INFINEON TECHNOLOGIES AG0 citations51
US7034383B2Apr 25, 2006
Electronic component and panel and method for producing the same
INFINEON TECHNOLOGIES AG0 citations50
US7180162B2Feb 20, 2007
Arrangement for reducing stress in substrate-based chip packages
INFINEON TECHNOLOGIES AG1 citations48
US7036216B2May 2, 2006
Method and apparatus for connecting at least one chip to an external wiring configuration
INFINEON TECHNOLOGIES AG0 citations41
US6429537B2Aug 6, 2002
Semiconductor component with method for manufacturing
INFINEON TECHNOLOGIES AG0 citations39
OSRAM GMBH
5 patentsUS9893230B2Feb 13, 2018
Producing a lighting module
OSRAM GMBH4 citations73
US10054292B2Aug 21, 2018
Lighting device and method of manufacturing it
OSRAM GMBH1 citations51
US9923129B2Mar 20, 2018
Method for producing an LED module and LED module
OSRAM GMBH0 citations41
US9696004B2Jul 4, 2017
Lighting device and corresponding method
OSRAM GMBH0 citations40
US10281090B2May 7, 2019
Lighting device and corresponding manufacturing method
OSRAM GMBH0 citations36