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Inventor
ETTINGSHAUSEN FRANK
DE
4 patents
⚠️ This page may combine multiple inventors who share the name “ETTINGSHAUSEN FRANK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IXYS CORP
2 patents
US9941256B1
Apr 10, 2018
Inverse diode stack
IXYS CORP
2 citations
69
US9704832B1
Jul 11, 2017
Die stack assembly using an edge separation structure for connectivity through a die of the stack
IXYS CORP
0 citations
47
LITTELFUSE INC
2 patents
US10854581B2
Dec 1, 2020
Die stack assembly using an edge separation structure for connectivity through a die of the stack
LITTELFUSE INC
0 citations
47
US10734362B2
Aug 4, 2020
Die stack assembly using an edge separation structure for connectivity through a die of the stack
LITTELFUSE INC
0 citations
47