Inventor
SPANN THOMAS
DE18 patents
⚠️ This page may combine multiple inventors who share the name “SPANN THOMAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IXYS CORP
8 patentsUS9443792B1Sep 13, 2016
Bridging DMB structure for wire bonding in a power semiconductor device module
IXYS CORP17 citations88
US10062621B2Aug 28, 2018
Power semiconductor device module having mechanical corner press-fit anchors
IXYS CORP3 citations72
US10000423B1Jun 19, 2018
Direct metal bonding on carbon-covered ceramic contact projections of a ceramic carrier
IXYS CORP2 citations72
US9929066B1Mar 27, 2018
Power semiconductor device module baseplate having peripheral heels
IXYS CORP5 citations72
US9941256B1Apr 10, 2018
Inverse diode stack
IXYS CORP2 citations69
US9640461B1May 2, 2017
Bridging DMB structure for wire bonding in a power semiconductor module
IXYS CORP4 citations68
US8901723B2Dec 2, 2014
Electrically isolated power semiconductor package with optimized layout
IXYS CORP2 citations60
US9177888B2Nov 3, 2015
Electrically isolated power semiconductor package with optimized layout
IXYS CORP0 citations49
LITTELFUSE INC
5 patentsUS11798868B2Oct 24, 2023
Metal tab for chip assembly
LITTELFUSE INC0 citations62
US12581990B2Mar 17, 2026
Metal tab for power semiconductor module
LITTELFUSE INC0 citations52
US12543611B2Feb 3, 2026
Method to connect power terminal to substrate within semiconductor package
LITTELFUSE INC0 citations52
US12545011B2Feb 10, 2026
Methods of preparing metal sheets for a DCB / DAB substrate bonding process
LITTELFUSE INC0 citations51
US10446462B2Oct 15, 2019
Heat transfer plate having small cavities for taking up a thermal transfer material
LITTELFUSE INC0 citations51