Inventor
GE YOU
CN18 patents
⚠️ This page may combine multiple inventors who share the name “GE YOU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NXP USA INC
7 patentsUS11515238B2Nov 29, 2022
Power die package
NXP USA INC2 citations72
US11456188B2Sep 27, 2022
Method of making flexible semiconductor device with graphene tape
NXP USA INC0 citations62
US11984408B2May 14, 2024
Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation
NXP USA INC0 citations58
US12051642B2Jul 30, 2024
QFN semiconductor package, semiconductor package and lead frame
NXP USA INC0 citations51
US11171077B2Nov 9, 2021
Semiconductor device with lead frame that accommodates various die sizes
NXP USA INC0 citations51
US10692802B2Jun 23, 2020
Flexible semiconductor device with graphene tape
NXP USA INC0 citations51
US10217697B2Feb 26, 2019
Semiconductor device and lead frame with high density lead array
NXP USA INC0 citations41
FREESCALE SEMICONDUCTOR INC
5 patentsUS9548255B1Jan 17, 2017
IC package having non-horizontal die pad and flexible substrate therefor
FREESCALE SEMICONDUCTOR INC7 citations83
US9379035B1Jun 28, 2016
IC package having non-horizontal die pad and lead frame therefor
FREESCALE SEMICONDUCTOR INC7 citations83
US9355945B1May 31, 2016
Semiconductor device with heat-dissipating lead frame
FREESCALE SEMICONDUCTOR INC12 citations83
US10041195B2Aug 7, 2018
Woven signal-routing substrate for wearable electronic devices
FREESCALE SEMICONDUCTOR INC3 citations72
US9449901B1Sep 20, 2016
Lead frame with deflecting tie bar for IC package
FREESCALE SEMICONDUCTOR INC2 citations62