Inventor

LYE MENG KONG

MY29 patents

⚠️ This page may combine multiple inventors who share the name “LYE MENG KONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LYE MENG KONG

NXP USA INC

Power die package

Lead frame with bendable leads

Sensor device with flip-chip die and interposer

Method of making flexible semiconductor device with graphene tape

Lead frame for integrated circuit device having J-leads and gull wing leads

QFN semiconductor package, semiconductor package and lead frame

Semiconductor device with lead frame that accommodates various die sizes

Flexible semiconductor device with graphene tape

Hybrid lead frame for semiconductor die package with improved creepage distance

Semiconductor device and lead frame with high density lead array

Lead frame for integrated circuit device having J-leads and Gull Wing leads

FREESCALE SEMICONDUCTOR INC

IC package having non-horizontal die pad and flexible substrate therefor

IC package having non-horizontal die pad and lead frame therefor

Semiconductor device with heat-dissipating lead frame

Woven signal-routing substrate for wearable electronic devices

Signal bond wire shield

Lead frame with deflecting tie bar for IC package

GE YOU

Semiconductor device with heat spreader

Semiconductor device with integral heat sink

Semiconductor device with tube based heat spreader

VERMA CHETAN

Bond pad for semiconductor die

Method for reducing surface area of pad limited semiconductor die layout

YOW KAI YUN

Semiconductor package with stress relief and heat spreader

LIM SHEAU MEI

Common pin for multi-die semiconductor package

VARSHNEY SUMIT

Semiconductor device with improved shielding

CHEE SOO CHOONG

Semiconductor device with twisted leads

MEI PENGLIN

Lead frame based semiconductor device with routing substrate

KUMAR SHAILESH

Integrated circuit die with corner IO pads

FOONG CHEE SENG

Power bar design for lead frame-based packages