Inventor

KONDO KOJI

JP79 patents

⚠️ This page may combine multiple inventors who share the name “KONDO KOJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KONDO KOJI

DENSO CORP

Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device

Printed wiring board and method of manufacturing a printed wiring board

Multilayer circuit board

Printed circuit board and its manufacturing method

Enhancement of current-carrying capacity of a multilayer circuit board

Printed wiring board and method for manufacturing printed wiring board

Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method

Mounting structure of electronic component on substrate board

Electronic-component mounting structure

Electronic control apparatus and method for on-board rewriting of non-volatile memories

Electroless plating solution

Method for manufacturing multi-layer printed circuit board

Manufacturing method for a printed circuit board

Method for manufacturing printed wiring board with embedded electric device

Method of manufacturing a printed wiring board

Manufacturing method of rigid-flexible printed circuit board and structure thereof

Method for manufacturing printed wiring board

Method for manufacturing multilayer circuit board

Multi-layer printed circuit board and method for manufacturing the same

Vehicular AC current generator rotor having field-coil winding finishing-end hook portions

Mounting structure of electronic component on substrate board

Manufacturing method of multilayer substrate

Printed circuit board having colored outer layer

Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board

NIPPON DENSO CO

Soldering method

Solution for catalytic treatment, method of applying catalyst to substrate and method of forming electrical conductor

Printed circuit board having a plurality of via-holes

Electroless copper plating solution and process for formation of copper film

Electroless copper plating solution and process for formation of copper film

Process of joining metal members

Electroless copper plating solution and process for electrolessly plating copper

Soldered product

Method and an apparatus for detecting concentration of a chemical treating solution and an automatic control apparatus thereof

Electroless copper plating solution

Process for electrolessly plating copper and plating solution therefor

Electroless copper plating solution

NINTENDO CO LTD

Sound generating device and video game device using the same

Video game apparatus outputting image and music and storage medium used therefor

Video game apparatus outputting image and music and storage medium used therefor

Sound generation device and sound generation program

SONY CORP

Image generating apparatus and method

Image display apparatus and method

Image display apparatus and method

PROCTER & GAMBLE

Pharmaceutical dosage form with multiple enteric polymer coatings for colonic delivery

Bisacodyl dosage form with multiple enteric polymer coatings for colonic delivery

NEC ELECTRONICS CORP

Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns

KAJIMA CORP

Ultra-high multi-story buildings and construction thereof

MATSURA KIKAI SEISAKUSHO KK

Nozzle device for cutting fluid for machine tools

OKI SEMICONDUCTOR CO LTD

Wireless LAN system making quality of communication improve and a communication method therefor

HONDA MOTOR CO LTD

Container holder including a swing member rotatably supporting a roller to hold a container received therein