Inventor
YOKOCHI TOMOHIRO
JP16 patents
⚠️ This page may combine multiple inventors who share the name “YOKOCHI TOMOHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DENSO CORP
15 patentsUS6680441B2Jan 20, 2004
Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device
DENSO CORP44 citations96
US6641898B2Nov 4, 2003
Printed wiring board and method of manufacturing a printed wiring board
DENSO CORP51 citations96
US6449836B1Sep 17, 2002
Method for interconnecting printed circuit boards and interconnection structure
DENSO CORP78 citations93
US6713687B2Mar 30, 2004
Printed wiring board and method for manufacturing printed wiring board
DENSO CORP24 citations91
US6667443B2Dec 23, 2003
Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method
DENSO CORP18 citations91
US7165321B2Jan 23, 2007
Method for manufacturing printed wiring board with embedded electric device
DENSO CORP15 citations84
US6972070B2Dec 6, 2005
Method of manufacturing a printed wiring board
DENSO CORP12 citations84
US7036214B2May 2, 2006
Manufacturing method of rigid-flexible printed circuit board and structure thereof
DENSO CORP19 citations83
US6527162B2Mar 4, 2003
Connecting method and connecting structure of printed circuit boards
DENSO CORP15 citations83
US7188412B2Mar 13, 2007
Method for manufacturing printed wiring board
DENSO CORP15 citations82
US6855625B2Feb 15, 2005
Manufacturing method of multilayer substrate
DENSO CORP6 citations72
US7323238B2Jan 29, 2008
Printed circuit board having colored outer layer
DENSO CORP7 citations70
US7061599B2Jun 13, 2006
Protective film for base substrates of multi-layered board and method and apparatus for inspecting base substrates
DENSO CORP2 citations62
US12501867B2Dec 23, 2025
Control device and non-transitory computer readable medium
DENSO CORP0 citations46
US12400923B2Aug 26, 2025
Semiconductor package, electronic device, and method for manufacturing semiconductor package
DENSO CORP0 citations43