Inventor

MURAI TADASHI

JP2 patents

⚠️ This page may combine multiple inventors who share the name “MURAI TADASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEC ELECTRONICS CORP

1 patent

US7378745B2May 27, 2008

Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns

NEC ELECTRONICS CORP39 citations89

DENSO CORP

1 patent

US7323238B2Jan 29, 2008

Printed circuit board having colored outer layer

DENSO CORP7 citations70