Inventor
CHEN CHIEH-YEN
TW37 patents
Patents
37 patentsUS10777518B1Sep 15, 2020
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD19 citations86
US10672728B2Jun 2, 2020
Integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10510679B2Dec 17, 2019
Semiconductor device with shield for electromagnetic interference
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9818722B1Nov 14, 2017
Package structure and method for manufacturing thereof
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US12327796B2Jun 10, 2025
Architecture for computing system package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations75
US11769731B2Sep 26, 2023
Architecture for computing system package
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations75
US11621244B2Apr 4, 2023
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations75
US12125798B2Oct 22, 2024
Semiconductor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11948926B2Apr 2, 2024
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11532533B2Dec 20, 2022
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11527486B2Dec 13, 2022
Semiconductor device with shield for electromagnetic interference
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11387222B2Jul 12, 2022
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US11348886B2May 31, 2022
Integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11335767B2May 17, 2022
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11244896B2Feb 8, 2022
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10867936B2Dec 15, 2020
Semiconductor device with shield for electromagnetic interference
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10847304B2Nov 24, 2020
InFO coil on metal plate with slot
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10510682B2Dec 17, 2019
Semiconductor device with shield for electromagnetic interference
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10304614B2May 28, 2019
Stacked coil for wireless charging structure on InFO package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12191270B2Jan 7, 2025
Integrated circuit package and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations64
US12068295B2Aug 20, 2024
Deep partition power delivery with deep trench capacitor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12051649B2Jul 30, 2024
Architecture for computing system package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11784172B2Oct 10, 2023
Deep partition power delivery with deep trench capacitor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11600431B2Mar 7, 2023
InFO coil on metal plate with slot
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12412799B2Sep 9, 2025
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12334457B2Jun 17, 2025
Integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12315854B2May 27, 2025
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12278214B2Apr 15, 2025
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12165952B2Dec 10, 2024
Interposer directly bonded to bonding pads on a plurality of dies
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12057407B2Aug 6, 2024
Semiconductor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11929333B2Mar 12, 2024
Integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12417991B2Sep 16, 2025
Chip stack structure with conductive plug and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US11211371B2Dec 28, 2021
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10825602B2Nov 3, 2020
Stacked coil for wireless charging structure on InFO package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10510478B2Dec 17, 2019
Stacked coil for wireless charging structure on InFO package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10269481B2Apr 23, 2019
Stacked coil for wireless charging structure on InFO package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10163854B2Dec 25, 2018
Package structure and method for manufacturing thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52