Inventor
ONITSUKA YOSHITOMO
JP7 patents
Patents
7 patentsUS12177983B2Dec 24, 2024
Electronic component housing package, electronic device, and electronic module
KYOCERA CORP1 citations59
US10945338B2Mar 9, 2021
Wiring substrate
KYOCERA CORP0 citations56
US12009285B2Jun 11, 2024
Substrate having a recessed portion for an electronic component
KYOCERA CORP0 citations48
US10182508B2Jan 15, 2019
Electronic component housing package, multi-piece wiring substrate, and method for manufacturing electronic component housing package
KYOCERA CORP0 citations48
US11264967B2Mar 1, 2022
Multi-piece wiring substrate, electronic component housing package, electronic device, and electronic module
KYOCERA CORP0 citations46
US10991671B2Apr 27, 2021
Multi-piece wiring substrate, electronic component housing package, and electronic device
KYOCERA CORP0 citations46
US10499510B2Dec 3, 2019
Multi-piece wiring substrate, wiring substrate, and method for manufacturing multi-piece wiring substrate
KYOCERA CORP0 citations46