Inventor

KUMAR RAJNEESH

US97 patents

⚠️ This page may combine multiple inventors who share the name “KUMAR RAJNEESH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KUMAR RAJNEESH

JUNIPER NETWORKS INC

Wan link selection for SD-WAN services

Dynamic prediction and management of application service level agreements

On-demand probing for quality of experience metrics

Satisfying service level agreement metrics for unknown applications

SLA packet steering in network service function chaining

Monitoring server performance using server processing time

Tunnel processing distribution based on traffic type and learned traffic processing metrics

Real-time application-driven synthetic probing

On-demand probing for quality of experience metrics

Tunnel processing distribution based on traffic type and learned traffic processing metrics

Network performance monitoring using an active measurement protocol and relay mechanism

Dynamic prediction and management of application service level agreements

SLA packet steering in network service function chaining

Network performance monitoring using an active measurement protocol and relay mechanism

Wan link selection for SD-WAN services

QUALCOMM INC

Integrated device comprising embedded package on package (PoP) device

Ultra fine pitch and spacing interconnects for substrate

Antenna module configurations

Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability

Power management integrated circuit (PMIC) integration into a processor package

Package-on-Package (PoP) device comprising a gap controller between integrated circuit (IC) packages

Ultra fine pitch and spacing interconnects for substrate

Sub-module L-shaped millimeter wave antenna-in-package

Semiconductor package with embedded components and method of making the same

Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employing a substrate sidewall partial shield for electro-magnetic interference (EMI) shielding, and related fabrication methods

Systems for shielding bent signal lines

Device comprising multi-directional antennas in substrates coupled through flexible interconnects

Sub-module L-shaped millimeter wave antenna-in-package

Solder on trace technology for interconnect attachment

Package comprising passive device configured as electromagnetic interference shield

CISCO TECH INC

Method and system for media synchronization in QoS-enabled wireless networks

System and method for single action initiation of a video conference

Multiple wireless spanning tree protocol for use in a wireless mesh network

Correlating object state changes with application performance

Packet aging in a wireless network

Method and system for evaluting number of additional admissible calls for use in call admission control

Methods and apparatus for efficient MPEG transmission over 802.11

IBM

Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package

Flip chip assembly method employing post-contact differential heating

Enhanced thermal conducting formulations

Enhanced thermal conducting formulations

Disk utilization analysis

Reversible thermal thickening grease

APPLE INC

Forbidden-resource-unit indication for coexisting communication

Apparatus and method for scheduled uplink multi-user access with concurrent peer-to-peer communications

Apparatus, method, and medium for implementing a target wake time

STEPHENSON DAVID SHELDON

Mobile intelligent roaming using multi-modal access point devices

PARKER HANNIFIN CORP

Auxiliary power module

BERNIER WILLIAM E

Uniform solder reflow fixture

MCBRIDE MICHAEL

Resource reservation on networks comprising wireless and wired segments