Inventor
LIAO WEN-FENG
TW3 patents
Patents
3 patentsUS9535091B2Jan 3, 2017
Probe head, probe card assembly using the same, and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations68
US11994534B2May 28, 2024
Testing device for integrated circuit package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations55
US11604211B1Mar 14, 2023
Testing device and method for integrated circuit package
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations55