Inventor
LI SIYI
US26 patents
⚠️ This page may combine multiple inventors who share the name “LI SIYI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LIFETECH SCIENT SHENZHEN CO
8 patentsUS10687821B2Jun 23, 2020
Lung volume reduction elastic implant and lung volume reduction instrument
LIFETECH SCIENT SHENZHEN CO3 citations72
US10342549B2Jul 9, 2019
Lung volume-reducing elastic implant and instrument
LIFETECH SCIENT SHENZHEN CO3 citations70
US11234705B2Feb 1, 2022
Implant
LIFETECH SCIENT SHENZHEN CO0 citations62
US10905538B2Feb 2, 2021
Lung-volume-reduction elastic implant and lung-volume reduction instrument
LIFETECH SCIENT SHENZHEN CO1 citations62
US11877718B2Jan 23, 2024
Thrombus removal device
LIFETECH SCIENT SHENZHEN CO0 citations51
US11266415B2Mar 8, 2022
Lung volume reduction elastic implant and lung volume reduction instrument
LIFETECH SCIENT SHENZHEN CO0 citations51
US11058852B2Jul 13, 2021
Interventional medical instrument, delivery apparatus, and interventional medical system
LIFETECH SCIENT SHENZHEN CO0 citations51
US11291457B2Apr 5, 2022
Lung volume-reducing elastic implant and instrument
LIFETECH SCIENT SHENZHEN CO0 citations49
LAM RES CORP
6 patentsUS6930048B1Aug 16, 2005
Etching a metal hard mask for an integrated circuit structure
LAM RES CORP43 citations91
US6909195B2Jun 21, 2005
Trench etch process for low-k dielectrics
LAM RES CORP16 citations91
US6969685B1Nov 29, 2005
Etching a dielectric layer in an integrated circuit structure having a metal hard mask layer
LAM RES CORP18 citations84
US7226852B1Jun 5, 2007
Preventing damage to low-k materials during resist stripping
LAM RES CORP13 citations82
US6794293B2Sep 21, 2004
Trench etch process for low-k dielectrics
LAM RES CORP14 citations82
US7385287B2Jun 10, 2008
Preventing damage to low-k materials during resist stripping
LAM RES CORP1 citations50
APPLIED MATERIALS INC
4 patentsUS7790047B2Sep 7, 2010
Method for removing masking materials with reduced low-k dielectric material damage
APPLIED MATERIALS INC7 citations71
US7393795B2Jul 1, 2008
Methods for post-etch deposition of a dielectric film
APPLIED MATERIALS INC5 citations63
US7718543B2May 18, 2010
Two step etching of a bottom anti-reflective coating layer in dual damascene application
APPLIED MATERIALS INC3 citations60
US7758763B2Jul 20, 2010
Plasma for resist removal and facet control of underlying features
APPLIED MATERIALS INC0 citations39