Inventor
KIM JINCHEOL
KR18 patents
⚠️ This page may combine multiple inventors who share the name “KIM JINCHEOL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ABSOLICS INC
13 patentsUS11437308B2Sep 6, 2022
Packaging glass substrate for semiconductor, a packaging substrate for semiconductor, and a semiconductor apparatus
ABSOLICS INC3 citations71
US12469736B2Nov 11, 2025
Substrate carrier and substrate assembly comprising the same
ABSOLICS INC0 citations61
US12456653B2Oct 28, 2025
Packaging substrate and semiconductor device comprising the same
ABSOLICS INC1 citations61
US12198994B2Jan 14, 2025
Packaging substrate and method for manufacturing same
ABSOLICS INC1 citations61
US12027454B1Jul 2, 2024
Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same
ABSOLICS INC0 citations60
US11728259B2Aug 15, 2023
Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same
ABSOLICS INC0 citations60
US11469167B2Oct 11, 2022
Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same
ABSOLICS INC0 citations60
US12456672B2Oct 28, 2025
Packaging substrate having element group in cavity unit and semiconductor device comprising the same
ABSOLICS INC0 citations59
US11652039B2May 16, 2023
Packaging substrate with core layer and cavity structure and semiconductor device comprising the same
ABSOLICS INC0 citations59
US12288742B2Apr 29, 2025
Packaging substrate and semiconductor apparatus comprising same
ABSOLICS INC0 citations49
US12165979B2Dec 10, 2024
Packaging substrate and semiconductor apparatus comprising same
ABSOLICS INC0 citations49
US11981501B2May 14, 2024
Loading cassette for substrate including glass and substrate loading method to which same is applied
ABSOLICS INC0 citations49
US11967542B2Apr 23, 2024
Packaging substrate, and semiconductor device comprising same
ABSOLICS INC0 citations49
HEWLETT PACKARD DEVELOPMENT CO
4 patentsUS11209762B2Dec 28, 2021
Method for error handling in the toner refill process
HEWLETT PACKARD DEVELOPMENT CO6 citations81
US12181805B2Dec 31, 2024
Method for error handling in the toner refill process
HEWLETT PACKARD DEVELOPMENT CO0 citations59
US11892781B2Feb 6, 2024
Method for error handling in the toner refill process
HEWLETT PACKARD DEVELOPMENT CO0 citations59
US11320774B2May 3, 2022
Estimation of toner remaining rate
HEWLETT PACKARD DEVELOPMENT CO0 citations50