Inventor
KOGURA SHINTARO
JP15 patents
⚠️ This page may combine multiple inventors who share the name “KOGURA SHINTARO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI INT ELECTRIC INC
7 patentsUSD610559SFeb 23, 2010
Reaction tube
HITACHI INT ELECTRIC INC26 citations91
US10081868B2Sep 25, 2018
Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC6 citations72
US10036092B2Jul 31, 2018
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC3 citations72
US9340872B2May 17, 2016
Cleaning method, manufacturing method of semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC3 citations72
US10287680B2May 14, 2019
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC0 citations51
US10066294B2Sep 4, 2018
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC0 citations51
US10096463B2Oct 9, 2018
Method of manufacturing semiconductor device, substrate processing apparatus comprising exhaust port and multiple nozzles, and recording medium
HITACHI INT ELECTRIC INC1 citations50
KOKUSAI ELECTRIC CORP
7 patentsUS11434564B2Sep 6, 2022
Method of manufacturing semiconductor device, substrate processing apparatus, recording medium and method of processing substrate
KOKUSAI ELECTRIC CORP2 citations72
US11885016B2Jan 30, 2024
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12406843B2Sep 2, 2025
Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations60
US11823886B2Nov 21, 2023
Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations60
US11728159B2Aug 15, 2023
Method of manufacturing semiconductor device, surface treatment method, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations59
US11257669B2Feb 22, 2022
Method of manufacturing semiconductor device, surface treatment method, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations59
US11515152B2Nov 29, 2022
Method of manufacturing semiconductor device, substrate processing apparatus, and method of processing substrate
KOKUSAI ELECTRIC CORP0 citations49