Inventor
JEONG CHI HYEON
KR4 patents
Patents
4 patentsUS11488942B2Nov 1, 2022
Package structure
SAMSUNG ELECTRO MECH0 citations58
US12211649B2Jan 28, 2025
Multilayer capacitor and board having the same embedded therein
SAMSUNG ELECTRO MECH0 citations49
US12482607B2Nov 25, 2025
Capacitor component and capacitor-embedded substrate
SAMSUNG ELECTRO MECH0 citations48
US11812552B2Nov 7, 2023
Printed circuit board
SAMSUNG ELECTRO MECH0 citations44