Inventor
GLEIXNER ROBERT J
US18 patents
⚠️ This page may combine multiple inventors who share the name “GLEIXNER ROBERT J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
14 patentsUS11456036B1Sep 27, 2022
Predicting and compensating for degradation of memory cells
MICRON TECHNOLOGY INC5 citations83
US11244717B2Feb 8, 2022
Write operation techniques for memory systems
MICRON TECHNOLOGY INC4 citations72
US11735258B2Aug 22, 2023
Increase of a sense current in memory
MICRON TECHNOLOGY INC0 citations62
US11710517B2Jul 25, 2023
Write operation techniques for memory systems
MICRON TECHNOLOGY INC0 citations62
US11651825B2May 16, 2023
Random value generator
MICRON TECHNOLOGY INC0 citations62
US11568932B2Jan 31, 2023
Read cache for reset read disturb mitigation
MICRON TECHNOLOGY INC0 citations62
US11295811B2Apr 5, 2022
Increase of a sense current in memory
MICRON TECHNOLOGY INC0 citations62
US11868211B2Jan 9, 2024
Error detection and correction in memory
MICRON TECHNOLOGY INC0 citations61
US11823745B2Nov 21, 2023
Predicting and compensating for degradation of memory cells
MICRON TECHNOLOGY INC0 citations61
US11711987B2Jul 25, 2023
Memory electrodes and formation thereof
MICRON TECHNOLOGY INC0 citations61
US11705195B2Jul 18, 2023
Increase of a sense current in memory
MICRON TECHNOLOGY INC0 citations61
US11455210B1Sep 27, 2022
Error detection and correction in memory
MICRON TECHNOLOGY INC0 citations61
US11211122B1Dec 28, 2021
Increase of a sense current in memory
MICRON TECHNOLOGY INC0 citations61
US11978513B2May 7, 2024
Generating patterns for memory threshold voltage difference
MICRON TECHNOLOGY INC0 citations51
INTEL CORP
4 patentsUS7393772B2Jul 1, 2008
Wirebond structure and method to connect to a microelectronic die
INTEL CORP10 citations81
US7855103B2Dec 21, 2010
Wirebond structure and method to connect to a microelectronic die
INTEL CORP4 citations71
US6924554B2Aug 2, 2005
Wirebond structure and method to connect to a microelectronic die
INTEL CORP4 citations71
US6683383B2Jan 27, 2004
Wirebond structure and method to connect to a microelectronic die
INTEL CORP11 citations71