Inventor

LEE SAM K

US2 patents

Patents

2 patents

US12146235B2Nov 19, 2024

Plating and deplating currents for material co-planarity in semiconductor plating processes

APPLIED MATERIALS INC0 citations45

US9758893B2Sep 12, 2017

Electroplating methods for semiconductor substrates

APPLIED MATERIALS INC0 citations30