Inventor
WILEY JOHN P
US8 patents
Patents
8 patentsUS5191174AMar 2, 1993
High density circuit board and method of making same
IBM332 citations98
US4864722ASep 12, 1989
Low dielectric printed circuit boards
IBM59 citations93
US5142775ASep 1, 1992
Bondable via
IBM36 citations91
US4868350ASep 19, 1989
High performance circuit boards
IBM36 citations91
US4854038AAug 8, 1989
Modularized fabrication of high performance printed circuit boards
IBM48 citations91
US4916260AApr 10, 1990
Circuit member for use in multilayered printed circuit board assembly and method of making same
IBM30 citations83
US5114518AMay 19, 1992
Method of making multilayer circuit boards having conformal Insulating layers
IBM8 citations72
US4918574AApr 17, 1990
Multilayer circuit board with reduced susceptability to shorts caused by trapped impurities
IBM0 citations51