Inventor
SAHA BIJAY S
US18 patents
⚠️ This page may combine multiple inventors who share the name “SAHA BIJAY S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
EASTMAN KODAK CO
15 patentsUS4764445AAug 16, 1988
Electrographic magnetic carrier particles
EASTMAN KODAK CO53 citations96
US5512404AApr 30, 1996
Developer compositions exhibiting high development speeds
EASTMAN KODAK CO20 citations92
US5268249ADec 7, 1993
Magnetic carrier particles
EASTMAN KODAK CO26 citations92
US5190841AMar 2, 1993
Two-phase ferroelectric-ferromagnetic composite and carrier therefrom
EASTMAN KODAK CO21 citations92
US5106714AApr 21, 1992
Interdispersed two-phase ferrite composite and electrographic magnetic carrier particles therefrom
EASTMAN KODAK CO30 citations92
US5104761AApr 14, 1992
Interdispersed three-phase ferrite composite and electrographic magnetic carrier particles therefrom
EASTMAN KODAK CO25 citations92
US5061586AOct 29, 1991
Glass composite magnetic carrier particles
EASTMAN KODAK CO27 citations92
US4855206AAug 8, 1989
Rare earth containing magnetic carrier particles
EASTMAN KODAK CO30 citations92
US4855205AAug 8, 1989
Interdispersed two-phase ferrite composite and carrier therefrom
EASTMAN KODAK CO43 citations92
US5332645AJul 26, 1994
Low dusting carriers
EASTMAN KODAK CO13 citations74
US5500320AMar 19, 1996
High speed developer compositions with ferrite carriers
EASTMAN KODAK CO18 citations73
US5325161AJun 28, 1994
Device for developing an electrostatic image on an image member
EASTMAN KODAK CO17 citations73
US5306592AApr 26, 1994
Method of preparing electrographic magnetic carrier particles
EASTMAN KODAK CO18 citations73
US5381219AJan 10, 1995
Size distribution of carrier particles for use in a magnetic brush
EASTMAN KODAK CO2 citations62
US4990876AFeb 5, 1991
Magnetic brush, inner core therefor, and method for making such core
EASTMAN KODAK CO5 citations61
INTEL CORP
3 patentsUS7875503B2Jan 25, 2011
Reducing underfill keep out zone on substrate used in electronic device processing
INTEL CORP11 citations79
US8362627B2Jan 29, 2013
Reducing underfill keep out zone on substrate used in electronic device processing
INTEL CORP3 citations58
US7432202B2Oct 7, 2008
Method of substrate manufacture that decreases the package resistance
INTEL CORP4 citations58