Inventor
PERFECTO ERIC D
US43 patents
⚠️ This page may combine multiple inventors who share the name “PERFECTO ERIC D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
28 patentsUS5436412AJul 25, 1995
Interconnect structure having improved metallization
IBM148 citations99
US6036809AMar 14, 2000
Process for releasing a thin-film structure from a substrate
IBM112 citations98
US5549808AAug 27, 1996
Method for forming capped copper electrical interconnects
IBM113 citations98
US5545927AAug 13, 1996
Capped copper electrical interconnects
IBM50 citations96
US5534466AJul 9, 1996
Method of making area direct transfer multilayer thin film structure
IBM76 citations96
US6281452B1Aug 28, 2001
Multi-level thin-film electronic packaging structure and related method
IBM53 citations95
US6183588B1Feb 6, 2001
Process for transferring a thin-film structure to a substrate
IBM52 citations95
US6678949B2Jan 20, 2004
Process for forming a multi-level thin-film electronic packaging structure
IBM21 citations92
US6143117ANov 7, 2000
Process for transferring a thin-film structure to a temporary carrier
IBM28 citations92
US5310625AMay 10, 1994
Process for forming negative tone images of polyimides using base treatment of crosslinked polyamic ester
IBM24 citations92
US5300403AApr 5, 1994
Line width control in a radiation sensitive polyimide
IBM85 citations91
US6126761AOct 3, 2000
Process of controlling grain growth in metal films
IBM29 citations89
US9084378B2Jul 14, 2015
Under ball metallurgy (UBM) for improved electromigration
IBM11 citations84
US8381966B2Feb 26, 2013
Flip chip assembly method employing post-contact differential heating
IBM14 citations84
US9324669B2Apr 26, 2016
Use of electrolytic plating to control solder wetting
IBM5 citations73
US8937009B2Jan 20, 2015
Far back end of the line metallization method and structures
IBM6 citations73
US5464682ANov 7, 1995
Minimal capture pads applied to ceramic vias in ceramic substrates
IBM13 citations73
US9190376B1Nov 17, 2015
Organic coating to inhibit solder wetting on pillar sidewalls
IBM2 citations63
US7199450B2Apr 3, 2007
Materials and method to seal vias in silicon substrates
IBM2 citations62
US6235412B1May 22, 2001
Corrosion-resistant terminal metal pads for thin film packages
IBM4 citations62
US6083375AJul 4, 2000
Process for producing corrosion-resistant terminal metal pads for thin film packages
IBM5 citations62
US5483105AJan 9, 1996
Module input-output pad having stepped set-back
IBM5 citations62
US6638374B2Oct 28, 2003
Device produced by a process of controlling grain growth in metal films
IBM2 citations61
US6361627B1Mar 26, 2002
Process of controlling grain growth in metal films
IBM2 citations61
US9177928B1Nov 3, 2015
Contact and solder ball interconnect
IBM0 citations52
US9728440B2Aug 8, 2017
Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer
IBM0 citations51
US8910853B2Dec 16, 2014
Additives for grain fragmentation in Pb-free Sn-based solder
IBM0 citations51
US9142501B2Sep 22, 2015
Under ball metallurgy (UBM) for improved electromigration
IBM1 citations50
GLOBALFOUNDRIES INC
9 patentsUS9853006B2Dec 26, 2017
Semiconductor device contact structure having stacked nickel, copper, and tin layers
GLOBALFOUNDRIES INC47 citations98
US9396991B2Jul 19, 2016
Multilayered contact structure having nickel, copper, and nickel-iron layers
GLOBALFOUNDRIES INC46 citations98
US10002835B2Jun 19, 2018
Structure for establishing interconnects in packages using thin interposers
GLOBALFOUNDRIES INC6 citations83
US9607973B1Mar 28, 2017
Method for establishing interconnects in packages using thin interposers
GLOBALFOUNDRIES INC10 citations83
US9379007B2Jun 28, 2016
Electromigration-resistant lead-free solder interconnect structures
GLOBALFOUNDRIES INC10 citations81
US10041183B2Aug 7, 2018
Electrodeposition systems and methods that minimize anode and/or plating solution degradation
GLOBALFOUNDRIES INC2 citations73
US9576922B2Feb 21, 2017
Silver alloying post-chip join
GLOBALFOUNDRIES INC4 citations71
US9689084B2Jun 27, 2017
Electrodeposition systems and methods that minimize anode and/or plating solution degradation
GLOBALFOUNDRIES INC0 citations52
US9343420B2May 17, 2016
Universal solder joints for 3D packaging
GLOBALFOUNDRIES INC0 citations52