Inventor

DAWSON PETER F

US4 patents

⚠️ This page may combine multiple inventors who share the name “DAWSON PETER F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HEWLETT PACKARD CO

2 patents

US5621615AApr 15, 1997

Low cost, high thermal performance package for flip chips with low mechanical stress on chip

HEWLETT PACKARD CO135 citations96

US5268048ADec 7, 1993

Reworkable die attachment

HEWLETT PACKARD CO22 citations88

(unassigned)

2 patents

US5484964AJan 16, 1996

Surface mounting pin grid arrays

50 citations87

US5749988AMay 12, 1998

Reworkable die attachment to heat spreader

7 citations67