Inventor
KAWAGUCHI AKEMI
JP7 patents
Patents
7 patentsUS5645628AJul 8, 1997
Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD182 citations98
US5795828AAug 18, 1998
Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD43 citations96
US5953628ASep 14, 1999
Method for forming wiring for a semiconductor device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD25 citations91
US5863834AJan 26, 1999
Semiconductor device and method of manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD18 citations83
US6372928B1Apr 16, 2002
Layer forming material and wiring forming method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7 citations73
US5820746AOct 13, 1998
Metal surface state evaluation method and semiconductor device production method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD8 citations73
US5773639AJun 30, 1998
Layer forming material and wiring forming method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD5 citations73