Inventor

NISHIO MIKIO

JP16 patents

⚠️ This page may combine multiple inventors who share the name “NISHIO MIKIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

15 patents

US5645628AJul 8, 1997

Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD182 citations98

US6012967AJan 11, 2000

Polishing method and polishing apparatus

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD114 citations96

US5997385ADec 7, 1999

Method and apparatus for polishing semiconductor substrate

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD41 citations96

US5795828AAug 18, 1998

Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD43 citations96

US5769697AJun 23, 1998

Apparatus for holding substrate to be polished and apparatus and method for polishing substrate

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD41 citations92

US5223729AJun 29, 1993

Semiconductor device and a method of producing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD45 citations86

US6074289AJun 13, 2000

Apparatus for holding substrate to be polished

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD18 citations82

US5939132AAug 17, 1999

Alignment chips positioned in the peripheral part of the semiconductor substrate and method of manufacturing thereof

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD16 citations82

US5451261ASep 19, 1995

Metal film deposition apparatus and metal film deposition method

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD18 citations82

US5683921ANov 4, 1997

Semiconductor device and method of manufacturing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7 citations68

US6812493B2Nov 2, 2004

Thin-film semiconductor element and method of producing same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations62

US5868610AFeb 9, 1999

Mehtod and aparatus for polishing semiconductor substrate

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations62

MATSUSHITA ELECTRONICS CORP

1 patent

US6099390AAug 8, 2000

Polishing pad for semiconductor wafer and method for polishing semiconductor wafer

MATSUSHITA ELECTRONICS CORP19 citations92

NISHIO MIKIO

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device

Polishing method and polishing apparatus

Method and apparatus for polishing semiconductor substrate

Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device

Method and apparatus for polishing semiconductor substrate

Apparatus for polishing substrate using resin film or multilayer polishing pad

Method and apparatus for polishing semiconductor substrate

Apparatus for holding substrate to be polished and apparatus and method for polishing substrate

Semiconductor device and a method of producing the same

Apparatus for holding substrate to be polished

Alignment chips positioned in the peripheral part of the semiconductor substrate and method of manufacturing thereof

Metal film deposition apparatus and metal film deposition method

Semiconductor device and method of manufacturing the same

Thin-film semiconductor element and method of producing same

Mehtod and aparatus for polishing semiconductor substrate

MATSUSHITA ELECTRONICS CORP

Polishing pad for semiconductor wafer and method for polishing semiconductor wafer