Inventor

TUNG FRANCISCA

US8 patents

⚠️ This page may combine multiple inventors who share the name “TUNG FRANCISCA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DIGITAL EQUIPMENT CORP

3 patents

US5072075ADec 10, 1991

Double-sided hybrid high density circuit board and method of making same

DIGITAL EQUIPMENT CORP206 citations96

US4692839ASep 8, 1987

Multiple chip interconnection system and package

DIGITAL EQUIPMENT CORP37 citations91

US5387495AFeb 7, 1995

Sequential multilayer process for using fluorinated hydrocarbons as a dielectric

DIGITAL EQUIPMENT CORP21 citations90

ADVANPACK SOLUTIONS PTE LTD

2 patents

US6578754B1Jun 17, 2003

Pillar connections for semiconductor chips and method of manufacture

ADVANPACK SOLUTIONS PTE LTD546 citations98

US6592019B2Jul 15, 2003

Pillar connections for semiconductor chips and method of manufacture

ADVANPACK SOLUTIONS PTE LTD216 citations97

ADVANPAK SOLUTIONS PTE LTD

1 patent

US6681982B2Jan 27, 2004

Pillar connections for semiconductor chips and method of manufacture

ADVANPAK SOLUTIONS PTE LTD143 citations95

VLSI TECHNOLOGY

1 patent

US5587336ADec 24, 1996

Bump formation on yielded semiconductor dies

VLSI TECHNOLOGY46 citations88

VLSI TECHNOLOGY INC

1 patent

US5342495AAug 30, 1994

Structure for holding integrated circuit dies to be electroplated

VLSI TECHNOLOGY INC34 citations86