Inventor

CHEE CHOONG KOOI

MY26 patents

⚠️ This page may combine multiple inventors who share the name “CHEE CHOONG KOOI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEE CHOONG KOOI

INTEL CORP

Micro through-silicon via for transistor density scaling

Micro-electromechanical system (MEMS) polyelectrolyte gel network pump

Underfilling process in a molded matrix array package using flow front modifying solder resist

Stress-compensation layers in contact arrays, and processes of making same

Underfilling process in a molded matrix array package using flow front modifying solder resist

Protected bond fingers

Micro through-silicon via for transistor density scaling

Stacked through-silicon vias for multi-device packages

Chip packaging compositions, packages and systems made therewith, and methods of making same

Capillary underfill and mold encapsulation method and apparatus

Micro through-silicon via for transistor density scaling

Micro through-silicon via for transistor density scaling

Micro through-silicon via for transistor density scaling

Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same

Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same

Chip assemblies

Backside mold process for ultra thin substrate and package on package assembly

Micro-electromechanical system (mems) polyelectrolyte gel network pump

Stacked semiconductor package with flyover bridge

Embedded dual-sided interconnect bridges for integrated-circuit packages

Backside mold process for ultra thin substrate and package on package assembly

Microelectronic device attachment on a reverse microelectronic package

Package on wide I/O silicon

ALTERA CORP

Interconnection of an embedded die

Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same

LOO HOWE YIN

Microelectronic device attachment on a reverse microelectronic package