Inventor

RODBELL KENNETH P

US115 patents

⚠️ This page may combine multiple inventors who share the name “RODBELL KENNETH P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RODBELL KENNETH P

IBM

Grooved polishing pads and methods of use

Discrete placement of radiation sources on integrated circuit devices

Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor

Grooved polishing pads and methods of use

Multilayered polishing pad, method for fabricating, and use thereof

Method for plating copper conductors and devices formed

Interconnect structure using a Al2 Cu for an integrated circuit chip

Multilayered intermetallic connection for semiconductor devices

Tamper-proof electronic packages with stressed glass component substrate(s)

Activating reactions in integrated circuits through electrical discharge

Reactive material for integrated circuit tamper detection and response

Method and structure for reducing contact resistance between silicide contact and overlying metallization

Method of detecting and transmitting radiation detection information to a network

Method and structure for reduction of soft error rates in integrated circuits

Microstructure modification in copper interconnect structure

Method for electroplating on resistive substrates

Method for controlling the texture and microstructure of plated copper and plated structure

Process for fabricating a metallization structure

Multi-layer metal sandwich with taper and reduced etch bias and method for forming same

Multilayered intermetallic connection for semiconductor devices

Polishing pads with polymer filled fibrous web, and methods for fabricating and using same

Ultra thin, single phase, diffusion barrier for metal conductors

Polishing pad grooving method and apparatus

Multiple device test layout

Tamper-proof electronic packages with stressed glass component substrate(s)

Tamper-proof electronic packages formed with stressed glass

Heterogeneous miniaturization platform

Controlling fragmentation of chemically strengthened glass

Integrated circuit tamper detection and response

Multi-doped silicon antifuse device for integrated circuit

Microstructure modification in copper interconnect structures

On-chip radiation dosimeter

Method and structure for reducing contact resistance between silicide contact and overlying metallization

Microstructure modification in copper interconnect structure

Electroplated interconnection structures on integrated circuit chips

Stabilization of Ni monosilicide thin films in CMOS devices using implantation of ions before silicidation

Stabilization of Ni monosilicide thin films in CMOS devices using implantation of ions before silicidation

Polishing pads with polymer filled fibrous web, and methods for fabricating and using same

Optimization of storage and power consumption with soft error predictor-corrector

Method for enhancing aluminum interconnect properties

Integrated reactive material erasure element with phase change memory

Heterogeneous miniaturization platform

Tamper-proof electronic packages formed with stressed glass

Thin film interconnects with large grains

Integrated arming switch and arming switch activation layer for secure memory

CABRAL JR CYRIL

Microstructure modification in copper interconnect structures

Dosimeter powered by passive RF absorption

Alpha particle blocking wire structure and method fabricating same

INFINEON TECHNOLOGIES AG

Device interconnection

FAROOQ MUKTA G

Ionizing radiation blocking in IC chip to reduce soft errors