Inventor
FARTASH ARJANG
US22 patents
⚠️ This page may combine multiple inventors who share the name “FARTASH ARJANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
11 patentsUS6790775B2Sep 14, 2004
Method of forming a through-substrate interconnect
HEWLETT PACKARD DEVELOPMENT CO124 citations97
US6942318B2Sep 13, 2005
Chamber having a protective layer
HEWLETT PACKARD DEVELOPMENT CO22 citations92
US7025894B2Apr 11, 2006
Fluid-ejection devices and a deposition method for layers thereof
HEWLETT PACKARD DEVELOPMENT CO18 citations91
US6955835B2Oct 18, 2005
Method for forming compressive alpha-tantalum on substrates and devices including the same
HEWLETT PACKARD DEVELOPMENT CO6 citations73
US7552533B2Jun 30, 2009
Method of manufacturing a fluid ejector head
HEWLETT PACKARD DEVELOPMENT CO4 citations62
US7445810B2Nov 4, 2008
Method of making a tantalum layer and apparatus using a tantalum layer
HEWLETT PACKARD DEVELOPMENT CO3 citations62
US7081306B2Jul 25, 2006
Compressive alpha-tantalum thin film stack
HEWLETT PACKARD DEVELOPMENT CO3 citations62
US6926390B2Aug 9, 2005
Method of forming mixed-phase compressive tantalum thin films using nitrogen residual gas, thin films and fluid ejection devices including same
HEWLETT PACKARD DEVELOPMENT CO3 citations62
US7517060B2Apr 14, 2009
Fluid-ejection devices and a deposition method for layers thereof
HEWLETT PACKARD DEVELOPMENT CO5 citations61
US7132132B2Nov 7, 2006
Method of forming a fluid ejection device with a compressive alpha-tantalum layer
HEWLETT PACKARD DEVELOPMENT CO1 citations52
US6893116B2May 17, 2005
Fluid ejection device with compressive alpha-tantalum layer
HEWLETT PACKARD DEVELOPMENT CO1 citations52
INTEL CORP
9 patentsUS6501658B2Dec 31, 2002
Heatsink mounting with shock absorbers
INTEL CORP75 citations95
US6875931B2Apr 5, 2005
Retainer for circuit board assembly and method for using the same
INTEL CORP14 citations83
US6700800B2Mar 2, 2004
Retainer for circuit board assembly and method for using the same
INTEL CORP15 citations83
US6472612B2Oct 29, 2002
Printed circuit board with embedded thermocouple junctions
INTEL CORP17 citations83
US6791189B2Sep 14, 2004
Epoxy washer for retention of inverted SMT components
INTEL CORP5 citations73
US6691407B2Feb 17, 2004
Methods for retaining assembled components
INTEL CORP5 citations73
US7131193B2Nov 7, 2006
Heat-shrinkable retainer for PCB double-sided assembly
INTEL CORP3 citations62
US6906268B2Jun 14, 2005
Heat-shrinkable retainer for PCB double-sided assembly
INTEL CORP2 citations62
US6552275B2Apr 22, 2003
Surface mount component
INTEL CORP4 citations62