Inventor · disambiguated record
Chiyi Kao
Also filed as: KAO CHIYI
4 granted patents·19 citations·filing 2005–2005
71Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0176US7205673B1Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processingLSI LOGIC CORP·Filed 2005·Granted Apr 17, 2007·7 cites·3 claims
- 0272US8552560B2Alternate pad structures/passivation inegration schemes to reduce or eliminate IMC cracking in post wire bonded dies during Cu/Low-K BEOL processingBHATT HEMANSHU·Filed 2005·Granted Oct 8, 2013·7 cites·3 claims
- 0370US7531442B2Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processingLSI CORP·Filed 2005·Granted May 12, 2009·5 cites·4 claims
- 0440US8076779B2Reduction of macro level stresses in copper/low-K wafersSUN SEY-SHING·Filed 2005·Granted Dec 13, 2011·0 cites·4 claims
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