Inventor · disambiguated record
Allen K. Lam
Also filed as: LAM ALLEN · LAM ALLEN K
13 granted patents·1 pending application·645 citations·filing 1999–2008
93Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0195US6307755B1Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor dieFiled 1999·Granted Oct 23, 2001·277 cites·13 claims
- 0295US6256200B1Symmetrical package for semiconductor dieFiled 1999·Granted Jul 3, 2001·233 cites·3 claims
- 0390US6800932B2Package for semiconductor die containing symmetrical lead and heat sinkADVANCED ANALOGIC TECH INC·Filed 2002·Granted Oct 5, 2004·54 cites·11 claims
- 0482US7215012B2Space-efficient package for laterally conducting deviceGEM SERVICES INC·Filed 2003·Granted May 8, 2007·25 cites·6 claims
- 0576US7667309B2Space-efficient package for laterally conducting deviceGEM SERVICES INC·Filed 2008·Granted Feb 23, 2010·5 cites·7 claims
- 0665US6452802B2Symmetrical package for semiconductor dieADVANCED ANALOGIC TECH INC·Filed 2001·Granted Sep 17, 2002·10 cites·7 claims
- 0753USD488136SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Apr 6, 2004·8 cites·1 claims
- 0853USD487431SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Mar 9, 2004·8 cites·1 claims
- 0952US7485498B2Space-efficient package for laterally conducting deviceGEM SERVICES INC·Filed 2007·Granted Feb 3, 2009·0 cites·5 claims
- 1050USD485808SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Jan 27, 2004·7 cites·1 claims
- 1147USD513608SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Jan 17, 2006·6 cites·1 claims
- 1247USD505122SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted May 17, 2005·6 cites·1 claims
- 1347USD505121SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted May 17, 2005·6 cites·1 claims
- 1443US2008017966A1Pillar Bump Package TechnologyADVANCED ANALOGIC TECH INC·Filed 2007·Application pending·0 cites
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