Inventor
MELVILLE IAN D
US32 patents
⚠️ This page may combine multiple inventors who share the name “MELVILLE IAN D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
17 patentsUS9059167B2Jun 16, 2015
Structure and method for making crack stop for 3D integrated circuits
IBM8 citations84
US8022543B2Sep 20, 2011
Underbump metallurgy for enhanced electromigration resistance
IBM11 citations84
US7919356B2Apr 5, 2011
Method and structure to reduce cracking in flip chip underfill
IBM8 citations84
US7375021B2May 20, 2008
Method and structure for eliminating aluminum terminal pad material in semiconductor devices
IBM10 citations84
US6831363B2Dec 14, 2004
Structure and method for reducing thermo-mechanical stress in stacked vias
IBM18 citations83
US7648891B2Jan 19, 2010
Semiconductor chip shape alteration
IBM7 citations74
US7622737B2Nov 24, 2009
Test structures for electrically detecting back end of the line failures and methods of making and using the same
IBM7 citations74
US7573115B2Aug 11, 2009
Structure and method for enhancing resistance to fracture of bonding pads
IBM3 citations63
US7470985B2Dec 30, 2008
Solder connector structure and method
IBM2 citations63
US7875502B2Jan 25, 2011
Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners
IBM5 citations62
US7867887B2Jan 11, 2011
Structure and method for enhancing resistance to fracture of bonding pads
IBM0 citations52
US7732932B2Jun 8, 2010
Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners
IBM1 citations52
US8741769B2Jun 3, 2014
Semiconductor device having a copper plug
IBM0 citations51
US8674506B2Mar 18, 2014
Structures and methods to reduce maximum current density in a solder ball
IBM1 citations51
US8835289B2Sep 16, 2014
Wafer backside defectivity clean-up utilizing selective removal of substrate material
IBM0 citations48
US7816248B2Oct 19, 2010
Solder connector structure and method
IBM0 citations48
US10211175B2Feb 19, 2019
Stress-resilient chip structure and dicing process
IBM0 citations39
FAROOQ MUKTA G
7 patentsUS8120175B2Feb 21, 2012
Soft error rate mitigation by interconnect structure
FAROOQ MUKTA G23 citations92
US8859390B2Oct 14, 2014
Structure and method for making crack stop for 3D integrated circuits
FAROOQ MUKTA G9 citations84
US8610283B2Dec 17, 2013
Semiconductor device having a copper plug
FAROOQ MUKTA G7 citations83
US10784200B2Sep 22, 2020
Ionizing radiation blocking in IC chip to reduce soft errors
FAROOQ MUKTA G2 citations73
US8999764B2Apr 7, 2015
Ionizing radiation blocking in IC chip to reduce soft errors
FAROOQ MUKTA G2 citations63
US8445374B2May 21, 2013
Soft error rate mitigation by interconnect structure
FAROOQ MUKTA G0 citations52
US8749059B2Jun 10, 2014
Semiconductor device having a copper plug
FAROOQ MUKTA G0 citations51