Inventor
EN HONCHIN
JP18 patents
⚠️ This page may combine multiple inventors who share the name “EN HONCHIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBIDEN CO LTD
15 patentsUS7691189B2Apr 6, 2010
Printed wiring board and its manufacturing method
IBIDEN CO LTD57 citations97
US7535095B1May 19, 2009
Printed wiring board and method for producing the same
IBIDEN CO LTD59 citations97
US7504719B2Mar 17, 2009
Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same
IBIDEN CO LTD33 citations96
US7230188B1Jun 12, 2007
Printed wiring board and its manufacturing method
IBIDEN CO LTD55 citations96
US6242079B1Jun 5, 2001
Printed wiring board and method for manufacturing the same
IBIDEN CO LTD67 citations96
US8030577B2Oct 4, 2011
Printed wiring board and method for producing the same
IBIDEN CO LTD9 citations92
US8020291B2Sep 20, 2011
Method of manufacturing a printed wiring board
IBIDEN CO LTD13 citations92
US8018045B2Sep 13, 2011
Printed circuit board
IBIDEN CO LTD18 citations92
US8006377B2Aug 30, 2011
Method for producing a printed wiring board
IBIDEN CO LTD9 citations92
US7993510B2Aug 9, 2011
Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board
IBIDEN CO LTD22 citations92
US7446263B2Nov 4, 2008
Multilayer printed circuit board
IBIDEN CO LTD15 citations92
US7827680B2Nov 9, 2010
Electroplating process of electroplating an elecrically conductive sustrate
IBIDEN CO LTD11 citations84
US7812262B2Oct 12, 2010
Multilayer printed circuit board
IBIDEN CO LTD9 citations84
US7514637B1Apr 7, 2009
Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board
IBIDEN CO LTD10 citations84
US7994433B2Aug 9, 2011
Printed wiring board and method for producing the same
IBIDEN CO LTD6 citations73