Inventor
TOH CHIN HOCK
SG19 patents
⚠️ This page may combine multiple inventors who share the name “TOH CHIN HOCK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOH CHIN HOCK
8 patentsUS8426246B2Apr 23, 2013
Vented die and package
TOH CHIN HOCK50 citations97
US8115292B2Feb 14, 2012
Interposer for semiconductor package
TOH CHIN HOCK37 citations89
US8143719B2Mar 27, 2012
Vented die and package
TOH CHIN HOCK13 citations83
US8647924B2Feb 11, 2014
Semiconductor package and method of packaging semiconductor devices
TOH CHIN HOCK8 citations74
US8703534B2Apr 22, 2014
Semiconductor packages and methods of packaging semiconductor devices
TOH CHIN HOCK2 citations61
US8772921B2Jul 8, 2014
Interposer for semiconductor package
TOH CHIN HOCK2 citations59
US9202801B2Dec 1, 2015
Thin substrate and mold compound handling using an electrostatic-chucking carrier
TOH CHIN HOCK2 citations58
US9219044B2Dec 22, 2015
Patterned photoresist to attach a carrier wafer to a silicon device wafer
TOH CHIN HOCK0 citations45
UNITED TEST & ASSEMBLY CT LT
6 patentsUS9142487B2Sep 22, 2015
Packaging structural member
UNITED TEST & ASSEMBLY CT LT44 citations96
US8384203B2Feb 26, 2013
Packaging structural member
UNITED TEST & ASSEMBLY CT LT50 citations96
US7948095B2May 24, 2011
Semiconductor package and method of making the same
UNITED TEST & ASSEMBLY CT LT45 citations93
US8741762B2Jun 3, 2014
Through silicon via dies and packages
UNITED TEST & ASSEMBLY CT LT3 citations62
US8030761B2Oct 4, 2011
Mold design and semiconductor package
UNITED TEST & ASSEMBLY CT LT2 citations62
US9117808B2Aug 25, 2015
Semiconductor packages and methods of packaging semiconductor devices
UNITED TEST & ASSEMBLY CT LT3 citations61