Inventor
KOLAN RAVI KANTH
SG13 patents
⚠️ This page may combine multiple inventors who share the name “KOLAN RAVI KANTH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED TEST & ASSEMBLY CT LT
5 patentsUS9142487B2Sep 22, 2015
Packaging structural member
UNITED TEST & ASSEMBLY CT LT44 citations96
US8384203B2Feb 26, 2013
Packaging structural member
UNITED TEST & ASSEMBLY CT LT50 citations96
US7883938B2Feb 8, 2011
Stacked die semiconductor package and method of assembly
UNITED TEST & ASSEMBLY CT LT13 citations77
US8741762B2Jun 3, 2014
Through silicon via dies and packages
UNITED TEST & ASSEMBLY CT LT3 citations62
US8030761B2Oct 4, 2011
Mold design and semiconductor package
UNITED TEST & ASSEMBLY CT LT2 citations62
TOH CHIN HOCK
4 patentsUS8426246B2Apr 23, 2013
Vented die and package
TOH CHIN HOCK50 citations97
US8115292B2Feb 14, 2012
Interposer for semiconductor package
TOH CHIN HOCK37 citations89
US8143719B2Mar 27, 2012
Vented die and package
TOH CHIN HOCK13 citations83
US8772921B2Jul 8, 2014
Interposer for semiconductor package
TOH CHIN HOCK2 citations59