Inventor
SUN ANTHONY YI SHENG
US15 patents
⚠️ This page may combine multiple inventors who share the name “SUN ANTHONY YI SHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED TEST & ASSEMBLY CT LTD
7 patentsUS7375416B2May 20, 2008
Leadframe enhancement and method of producing a multi-row semiconductor package
UNITED TEST & ASSEMBLY CT LTD15 citations88
US7323769B2Jan 29, 2008
High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package
UNITED TEST & ASSEMBLY CT LTD28 citations88
US7345357B2Mar 18, 2008
High density chip scale leadframe package and method of manufacturing the package
UNITED TEST & ASSEMBLY CT LTD3 citations62
US7723833B2May 25, 2010
Stacked die packages
UNITED TEST & ASSEMBLY CT LTD5 citations60
US7830006B2Nov 9, 2010
Structurally-enhanced integrated circuit package and method of manufacture
UNITED TEST & ASSEMBLY CT LTD4 citations58
US7816775B2Oct 19, 2010
Multi-die IC package and manufacturing method
UNITED TEST & ASSEMBLY CT LTD2 citations58
US7476569B2Jan 13, 2009
Leadframe enhancement and method of producing a multi-row semiconductor package
UNITED TEST & ASSEMBLY CT LTD2 citations58