Inventor
CURCIO BRIAN E
US18 patents
⚠️ This page may combine multiple inventors who share the name “CURCIO BRIAN E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
12 patentsUS6465084B1Oct 15, 2002
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
IBM116 citations99
US6638607B1Oct 28, 2003
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
IBM40 citations94
US6645607B2Nov 11, 2003
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
IBM24 citations92
US6504111B2Jan 7, 2003
Solid via layer to layer interconnect
IBM29 citations92
US7076869B2Jul 18, 2006
Solid via layer to layer interconnect
IBM10 citations74
US6955849B2Oct 18, 2005
Method and structure for small pitch z-axis electrical interconnections
IBM5 citations73
US6790305B2Sep 14, 2004
Method and structure for small pitch z-axis electrical interconnections
IBM8 citations73
US6634543B2Oct 21, 2003
Method of forming metallic z-interconnects for laminate chip packages and boards
IBM7 citations73
US6969436B2Nov 29, 2005
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
IBM6 citations72
US7402254B2Jul 22, 2008
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
IBM4 citations63
US7303639B2Dec 4, 2007
Method for producing Z-axis interconnection assembly of printed wiring board elements
IBM3 citations61
US6776852B2Aug 17, 2004
Process of removing holefill residue from a metallic surface of an electronic substrate
IBM0 citations52