Inventor

HSIEH MEI-LIN

TW5 patents

⚠️ This page may combine multiple inventors who share the name “HSIEH MEI-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED SEMICONDUCTOR ENG

2 patents

US11139225B2Oct 5, 2021

Device including a plurality of leads surrounding a die paddle and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations57

US11450596B2Sep 20, 2022

Lead frame, package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG1 citations55

YONKER JASON B

1 patent

US8214139B2Jul 3, 2012

Position source selection

YONKER JASON B20 citations85

CHEN KUANG-HSIUNG

1 patent

US8592962B2Nov 26, 2013

Semiconductor device packages with protective layer and related methods

CHEN KUANG-HSIUNG0 citations49

HSU YUEH-CHEN

1 patent

US8304865B2Nov 6, 2012

Leadframe and chip package

HSU YUEH-CHEN0 citations29